Material: FR4, KB6165Layer: 2L, TG150Surface: HAL LeadfreeBoard Thickness: 1.00 mm,Copper Finished: 1OzGreen&Blue Solder mask, White SilkscreenApplication: Used in outdoor sports device   

Material: FR4, KB6160Layer: 2LSurface: HAL LeadfreeBoard Thickness: 1.6 mm,Copper Finished: 1OzBlack Solder mask, White SilkscreenApplication: Used in game device   

Material: FR4, KB6165Layer: 2L, TG150Surface: Immersion SilverBoard Thickness: 1.60 mm,Copper Finished: 2OzBlue Solder mask, White SilkscreenApplication: Used in industrial control    

Material: FR4, SY1140Layer: 6L, TG150Surface: Immersion TinBoard Thickness: 1.60 mm,Copper Finished: 2/1/1/2OzBlue Solder mask, White SilkscreenApplication: Used in industrial control     

Material: FR4, KB6160Layer: 2LSurface: HAL LeadfreeBoard Thickness: 1.6 mm,Copper Finished: 1OzYellow Solder mask, White SilkscreenApplication: Used in game device   

Material: FR4, NP175FLayer: 8L, TG170Surface: Immersion Gold 2U"Board Thickness: 1.80 mm,Copper Finished: 2/1/1/1/1/1/1/2OzGreen Solder mask, White SilkscreenApplication: Used in industrial control   

Material: FR4, High Tg FR-4, Rogers Material, Metal CoreLayer: 1-32 layer Min Line/Space:0.1mm Min Hole Size:0.15mm Dimension Tolerance:±0.05mm Surface: Immersion TinBoard Thickness: 0.2-6.0 mmCopper Finished: 1oz-60Oz Manufacturing Process：  

Material: Polyimide Flex, FR-4 Rigid, Liquid Crystal Polymer, Adhesives Layer: 2-16 layer Min Line/Space:0.1mm Min Hole Size:0.15mm Bend Radius:±0.1mm Surface: Immersion TinBoard Thickness: 0.4-3.2 mmCopper Finished: 1oz-20Oz Manufacturing Process:   

Minimum hole size: 0.075mm Position accuracy: ±25μm Supports blind vias, buried vias, staggered vias, and more Compatible with 0.1mm pitch BGA packages Back-drilling technology controls stub length to < 8 mil Differential pair impedance control within ±7% Insertion loss optimization Crosstalk suppression solutions Industry: Medical Electronics, Automotive Electronics, Industrial Control   

Material: Alumina，Aluminum Nitride，Beryllium Oxide，LTCC Min Line Width:0.05mm Min Line Spacing:0.05mm Min Via Size: 0.1mm Via Pitch: 0.1mm Substrate Thickness: 0.25-1.5mm Manufacturing Process:

Standard aluminum substrates (1.0 mm- 3.0 mm thickness) High thermal conductivity aluminum substrates (>2.0W/mK) Copper substrates (1.0 mm- 5.0 mm thickness) Copper-aluminum composite substrates (balancing cost and performance) Advanced Processing Technology： High-precision CNC milling machines (metal substrate contouring) Laser drilling systems (microvia processing) Ceramic grinding lines (surface treatment) VCP (Vertical Continuous Plating) production lines   

High TG Rigid PCB Core parameters Item Rigid PCB Max Layer 60L Inner Layer Min Trace/Space 3/3mil Out Layer Min Trace/Space 3/3mil Inner Layer Max  Copper 6oz Out Layer Max Copper 6oz Min Mechanical Drilling 0.15mm Min Laser Drilling 0.1mm Aspect Ratio(Mechanical Drilling) 20:1 Aspect Ratio(Laser Drilling) 1:1 Press Fit Hole Ttolerance ±0.05mm PTH Tolerance ±0.075mm NPTH Tolerance ±0.05mm Countersink Tolerance ±0.15mm Board Thickness 0.4-8mm Board Thickness Tolerance(＜1.0mm) ±0.1mm Board Thickness Tolerance(≥1.0mm) ±10% Impedance Tolerance Single-Ended：±5Ω(≤50Ω)，±7%(＞50Ω) Differential：±5Ω(≤50Ω)，±7%(＞50Ω) Min Board Size 10*10mm Max Board Size 22.5*30inch Contour Tolerance &pl...